Founded in 2011 in Shenzhen, LEIENDA develops packaged LED components, COB light sources and application-specific LED assemblies. Projects can be defined around wavelength, spectrum, power, voltage, dimensions, board structure and multi-channel requirements.
Engineered for extreme performance. From high-density SMD displays to intense COB arrays, our OEM/ODM manufacturing empowers your most demanding projects.
High-efficiency surface mount LEDs designed for precision displays, commercial lighting, and compact electronics.
Advanced Chip-on-Board technology delivering intense, uniform light output with superior thermal management.
Ultra-compact footprint LEDs eliminating wire bonds for enhanced reliability and maximum lumen density.
Industrial-grade ultraviolet and near-infrared LEDs engineered for curing, sensing, and sterilization.
Individually controllable RGB modules perfect for dynamic gaming setups, e-sports arenas, and architectural accents.
Maximum luminance output components designed for stadium lighting, automotive headlights, and robust industrial use.
Select the emitter format first, then define wavelength, power, source dimensions and board-level integration around the equipment. LEIENDA covers packaged LEDs, COB sources, chip-level formats and custom PCB/FPC assemblies.
Package directions include 3030, 3535, 5050, 7070 and K2. Choose the package size, wavelength, power and chip arrangement according to the optical layout and thermal conditions of the equipment.
Explore High-Power SMD LEDs
Integrated COB sources suit projects that need multiple emitters arranged within a defined source area. Key selection inputs include spectrum, power, source dimensions, board structure and thermal path.
Explore COB LED Light Sources
LED die, LED wafer, CSP and flip-chip directions support projects that begin before package or board-level integration. Selection should define the emitter format, wavelength and intended assembly method.
View LED Die and Chip Formats
Board-level LED assemblies can be developed around dimensions, PCB or FPC structure, wavelength combinations and multi-channel layouts. This option suits equipment teams that need a light source prepared for their mechanical and electrical design.
View Custom PCB and FPC LED ModulesSubmit the target wavelength or spectrum, power, voltage, dimensions and board structure. LEIENDA can discuss SMD, COB, PCB or FPC configurations, including multi-wavelength combinations and multi-channel layouts.
Aligning the emitter choice and board-level structure with the same equipment requirement helps reduce specification gaps between component selection and module integration.
High-performance chip-on-board architectures engineered for precision illumination, advanced horticulture, and specialized industrial applications.
High-density white COB modules delivering exceptional lumens per watt with uniform light distribution. Engineered for commercial downlights, track lights, and high-bay industrial fixtures requiring uncompromising beam quality.
Founded in 2011 and based in Shiyan, Bao'an, Shenzhen, LEIENDA develops and manufactures high-power SMD LEDs, COB light sources and application-specific LED assemblies.
The product system connects packaged LED components with board-level light sources for B2B equipment projects. LEIENDA's Shenzhen workplace includes LED packaging equipment, production workstations and inspection workstations alongside component, COB and module operations.
Application requirements change the wavelength, package, channel layout and board structure of an LED source. LEIENDA develops component and module directions for red and near-infrared equipment, horticultural lighting, UV systems and dynamic color lighting.
Product directions include red and near-infrared LED packages and multi-wavelength combinations such as 660 nm and 850 nm. Equipment teams should define wavelength allocation, package geometry, channel layout, drive conditions and thermal path before selecting the source.
Plant-lighting projects require the spectral combination, power distribution and board layout to match the fixture structure and target growing environment. LED components and integrated modules can be discussed around these equipment inputs.
UV LED directions include examples across 365 to 420 nm for curing and disinfection equipment development. Selection should account for wavelength, package format, source arrangement, drive conditions and the validation requirements of the final system.
RGB, RGBW and addressable LED directions include package formats such as 2020, 3528, 3535, 4020 and 5050. Match package size, channel configuration and control architecture to the available board space and required lighting behavior.
Backed by 15 years of manufacturing excellence, our LED solutions meet the most rigorous international standards. Trust in verified performance for your enterprise needs.
European Conformity
Quality Management
Safety Compliance
Inspection & Testing
Explore LEIENDA's Shenzhen working environment and meet the team through company video, LED industry exhibitions and direct customer visits.
Tell us the product family, target application and key requirements such as wavelength, spectrum, power, voltage, dimensions or board structure. Attach a drawing or specification file when available to begin a product selection or custom module discussion.